Ultramid T - PA-Cop - BASF SE

Kunststoffe international, 2005-11-21, Engineering Plastics: Products for Innovative Processes
...of the PA6 base polymer (70% of a 1064nm-Nd-YAG laser), shorter cycle times, more complex geometries and lower section thickness can be achieved. BASF has launched a special grade for the laser direct structuring process (LDS) under the trade name Ultramid T KR 4380 LS. This is a specially tailored compound for the LDS process with 30% glass fibres and optimum properties in terms of initial metalisation behaviour and metal adhesion. Other variants, for example a low-warpage-optimised formulatio...

Kunststoffe international, 2007-10-21, Polyamides (PA)
... purpose, however, thermoplastics are required that can withstand the high temperatures of up to 245°C occurring in lead-free soldering. BASF has developed a semi-crystalline, partially aromatic, high-temperature polyamide, Ultramid T 4381 LDS, specially for laser direct structuring. Other Applications In the packaging sector, too, polyamides continue to be widely used. Here they are primarily employed as an intermediate layer in multi-layer film systems; pure PA film applications tend to be r...

Kunststoffe international, 2008-06-16, We're Moving towards Specialties
...ufacture inexpensive controls, sensors and connectors that are suitably sealed against oil, water and gas with a high degree of design freedom Fig. 3. The 3-D switch support from Kromberg & Schubert is an innovative MID component made out of Ultramid T 4381 LDS from BASF. This further improved polyamide 6/6T can be laser activated and metallized Fig. 4. In their new window frame profiles aluplast were able to replace the metal stiffeners (right: red) with significantly lighter strips of Ultradur...

Kunststoffe international, 2008-10-17, Polyamides (PA)
...). Another innovative polyamide and its corresponding technology make it possible to install conductive paths on complex, three-dimensional electronic parts without wiring and in very few steps: With the aid of a high-temperature BASF polyamide, Ultramid T LDS with laser-sensitive pigments, the conductor pattern can be engraved in the 3-D surface of the part using LDS (Laser Direct Structuring) – a process developed and patented by LPKF Laser & Electronics AG: The parts su...

Kunststoffe international, 2009-06-16, Ever More Electricity and Plastic
... well as the newest control models the specific requirements for dimensional stability and chemical resistance could be safely met by the material types used. Exceptional mechatronic components can be produced when laser activatable polymers such as Ultramid T 4381 LDS are used. This polymer contains laser sensitive additives. It can therefore be structured and activated with the help of a laser, so that in the steps that follow, metallic conducting tracks can be precisely applied to the three-d...

Kunststoffe international, 2011-10-17, Polyamides (PA)
...stance to chemicals such as fuel or cooling agents, partly aromatic polyamides are used. The major suppliers of these material types are DuPont (Zytel HTN) and Ems (Grivory NT). However, BASF also offers a partly aromatic PA, i.e. Ultramid T. Low water absorption and outstanding dimensional stability make long-chain, partly aromatic, polyamides the appropriate material for lead-free soldering in the E/E segment (Fig. 2). Suppliers of special polyamides have added partly aromatic products to thei...

Kunststoffe international, 2014-10-10, Polyamides (PA)
...ive solutions. In case the component is required to feature free colorability and good suitability for state-of-the-art soldering techniques with lead-free solder at high temperatures, users may apply partly aromatic polyamides such as Ultramid T KR 4340 G6 by BASF, based on color-neutral organic phosphorus compounds. Starting from 0.4 mm wall thickness, the material reaches V-0 according to UL94, and 5VA, starting from 1mm. What is more, it fulfills high requirements considering glow wire and c...